current densities/electroforming

Presently we mask-as-we-go building up in a fast sulfamate nickel bath. The parts have great variations in current density. First I would like to know what's out there to do some exacting current density calcs, then look more toward shielding rather than taking the part out repeatedly for various changes of masking.

Also what would pulse reverse current do to speed up the process? I understand the better even plate but does it increase tank time and if so what percentage? We are putting in too many man hours in each part.