ELECTROLESS DEPOSITION SEMINARS KICK OFF SUR/FIN 2008 TECH CONFERENCE

Washington, D.C., May 9—The highly touted Technical Conference at SUR/FIN 2008, which takes place at the Indiana Convention Center in Indianapolis next month, lifts off on Monday, June 16, 2 p.m. to 5 p.m., with a program dedicated to innovations in electroless nickel.

Track I of the program launches with “Corrosion Resistance of ELV-Compliant Mid- and Low/Mid-Phosphorous Electroless Nickel,” authored by Nicole Micyus, MacDermid, Inc. In summary: Mid- and low/mid-phosphorus electroless nickel (EN) deposits exhibit good resistance to corrosive media. Due to regulations in recent years (i.e., ELV, WEEE, RoHS), many new mid- and low/mid-phosphorus EN processes have been introduced using alternative stabilizers in order to comply. Electrochemical testing is used to compare conventional and ELV-compliant mid- and low/mid-phosphorus deposits in acidic and neutral solutions. Results are compared to the corrosion resistance of high-phosphorus EN. Differences in corrosion resistance due to bath age and deposit thickness are also investigated.

Next up is “Operational Experience Using an Organically Stabilized Electroless Nickel,” by Duncan Beckett, MacDermid, Inc. In summary: Electroless nickel deposits have historically used heavy metals as stabilizers and brighteners to give bright and easy-to-use processes. This paper will review the experiences gained in using an organically stabilized bath for customers with a range of production environments. The properties compared include plating speed, brightness, phosphorus content, stability, and activation on a range of substrates while seeking to compare these to other, traditional processes. It will also assess the performance of the deposit in tests such as electrochemical and salt spray corrosion, hardness, and wear.

Following is “A Revolutionary Electroless Nickel-PTFE Plating Process,” by Michael Feldstein and Thomas Lancsek, Surface Technology, Inc. In summary: This paper presents information on a revolutionary electroless nickel-PTFE composite plating process considered to be a quantum leap in plating rate, process, quality, and environmental properties. Composite electroless nickel is a widely accepted and growing segment of the plating industry. The inclusion of particulate matter within electroless nickel deposits can be a powerful enhancement of the coating’s inherent characteristics and, in many instances, adds entirely new properties to the plated layer. PTFE is one of the most commonly used materials in such plating. This is due to the exceptional low-friction and release properties of PTFE. However, there are many drawbacks to current commercial EN-PTFE plating bath systems. This paper demonstrates a new system with exceptional advantages over the present state of the art.

On the heels of that session comes “Electrodeposited Nickel Phosphorous,” by Darell Engelhaupt, University of Alabama in Huntsville. In summary: Nickel phosphorus was deposited first as a curiosity early in the last century. Later studies by Dr. Abner Brenner from NBS (now NIST) led to commercial electroless nickel plating. Electrodeposition of NiP was not favored over catalytic methods due to high temperature, corrosive electrolytes, and low efficiency/high hydrogen generation, coupled with non-uniformity of the deposit. The electrolytic processes remained in low demand due to the slow development of suitable electrolytes. Numerous attempts to improve the electrodeposition process have been made. Modern NiP electroplating developments improved the environmental impact and ability to plate any desired thickness with exceptional properties suitable for optical component fabrication.

Rounding out Track I is “Low Metal Operation (LMO) for Electroless Nickel Processes,” by John Szcypka, MacDermid, Inc. In summary: This paper will cover the operating parameters, deposit properties, and cost savings that result from this proven, innovative process. The paper will also present actual data that has been collected for more than five years from Tawas Plating and Powder Coating.

SUR/FIN 2008 is sponsored by the National Association for Surface Finishing (www.nasf.org). At SUR/FIN 2008, you’ll find a comprehensive technical program that includes sessions focused on OEM and captive platers, as well as the expansion of exhibitors and attendees to reflect the entire surface finishing supply chain. For more information about SUR/FIN 2008, please visit www.sur-fin.net or contact Cheryl Clark at (202) 457-8404; (e-mail) cclark@nasf.org.